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SavanSys Solutions LLC |
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Core Technology |
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Contact Us |
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The Leader in Electronics Manufacturing Supply Chain Cost Modeling |
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SavanSys Solutions LLC |
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At SavanSys Solutions LLC, our business is electronics manufacturing cost modeling. With the SavanSys Solution—a combination of expert consulting services and our unique SavanSys modeling technology—we provide the electronics industry with solutions for · Supply Chain Management · New Technology Introduction · Cost/Risk Reduction · And more!
What is the SavanSys Solution? It is based on our unique, patented SavanSys software: an activity based cost model that enables fabrication and assembly in a virtual prototype of you or your suppliers factories. Our experienced consultants work with you to identify where we can help and use the SavanSys software to find and demonstrate the solution. Learn more… What can we do for you? We can help no matter where you fit into the supply chain. For a comprehensive look at our capabilities look through our services and products sections. |
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Phone: 512-402-9943 E-mail: sales@savansys.com |
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New SavanSys Trade Off Cost Models Available! Our new Cost Trade Off products estimate package costs for Wire Bond or Flip Chip packages based on user specified design, assembly, and fabrication parameters. It’s based on a simple philosophy: allow users to estimate costs with limited data by maximizing the number of parameters available while minimizing the parameters required. |
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Use the Trade Off models to quantify the cost impact of design decisions such as... |
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Design · Package Size · Substrate Structure · Wire material (Wire bond) · umVia Count (Flip Chip) |
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Assembly · Labor Rate · Factory Utilization · Wafer Probe Yield · CSP Strip Size (Flip Chip) |
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Substrate · Labor Rate · Factory Utilization · Panel Size · Lot Size |
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Example parameters |
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Wire Bond · … using Au vs. Cu wire. · … a 2L, 4L, or laser drilled package. · … different manufacturing locations. · … changing the size of the package or the die. · … and more. |
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Flip Chip · … using a smaller package with a more complicated structure. · … placing discrete devices in the package. · … different manufacturing locations. · … using a larger package or die size? · … and more. |
