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Supply Chain Cost Modeling
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FLIP CHIP TRADE OFF COST MODEL

Model Highlights

 

Quickly see the impact of design decisions.

 

 

The SavanSys Wire Bond Trade Off Cost Model is designed with a simple philosophy: maximize the number of possible inputs while minimizing the number of required inputs.  For parameters not known or specified, SavanSys will not only estimate it based on your other entries and the latest industry knowledge, but will show you the value used.  This allows an unparalleled level of estimating customization without any training.  Use the estimator to:

 

· Define characteristics of the assembly site, fabrication site, and the design.  See the columns to the right for a complete list of parameters.

 

· Compare against your previous results to easily understand how your modification affect the cost

 

· View the detailed costs—including labor, material, capital, tooling, and yield impacts—of every step in the assembly process

 

An optional enhancement to the estimator is to create a model calibrated to a specific supplier (internal or external).  We can work with you to calibrate the model or work directly with the supplier to create a certified supplier model.

What’s the cost impact of...?

 

Parameter List

Design

Assembly

Fabrication

Pkg Size

Labor Rate

Labor Rate

Pkg I/O

Lot Size

Utilization

Structure

Annual Vol

Panel Size

Design Rules

Lifetime Vol

Lot Size

Stacked Vias

Wafer Probe Yield

 

Capacitors

Utilization

 

Core Material

Wafer Bump?

 

BGA Pitch

CSP Strip Size

 

umVia Count

 

 

PTH Count

 

 

Lid

 

 

Surface Finish

 

 

Die Size

 

 

Die Cost