SavanSys Core Technology

The native SavanSys software offers the user complete flexibility and freedom throughout the modeling process. The user can import or create the board design including the number and type of components, packaging, costs, and design rules. The software's flexible, activity-based modeling framework allows the user to define the fabrication and assembly processes as a series of steps that include process times, learning curves, capitalization costs, tooling costs, and more. On analysis, the software steps through the users specified fabrication and assembly processes as it simulates the production of the virtual board or module. The software tracks and displays cost and yield information at each step in the process allowing the user to readily identify the design features that drive the time and cost.

SavanSys Description

Figure 1: SavanSys Design Flow

Concurrent Analysis

Once a virtual prototype is constructed in SavanSys, is it analyzed using the concurrent analysis engines of the tool. Since individual design changes may simultaneously affect different aspects of the design, these analyses are run simulaneously, giving the designer a complete system-level view of the impact of his or her decisions. The tool performs the following analyses:

· Size & Routability - The ultimate size of a substrate is affected by component packaging choices, technology and design rules for interconnect, and required routing resources. SavanSys considers all of these factors simultaneously to calculate the substrate size and number of routing layers. Routing resources are estimated with 4 different algorithms (Nearest Neighbor, Rent's Rule, Coor's, and Hannemans).

· Placement & Partitioning - A SavanSys system is made up of one or more substrates and components. When these components are moved between substrates, it affects not only the substrate itself but also the interconnect requirements between substrates. For example, a typical SavanSys analysis may be done on a motherboard that includes mezzanine boards containing MCMs. Individual components can be moved quickly and easily between all three substrates.

· Critical Net & Electrical - SavanSys will perform a detailed RLC analysis of a critical net including resistance, capacitance, and inductance effects of chip bonding, packaging, and routing. SavanSys utilizes SPICE to perform this analysis, but all analysis controls and results are accessed from within the tool.

· Cost Analysis - SavanSys is the most advanced cost prediciton solution for the packaging and interconnection of high-density electronic systems available for use in design-to-cost and design-for-manufacturing methodologies in the industry. An integrated suite of technical, activity-based cost models for assembly, substrate fabrication, and chip preparation provide an unmatched flexibility to capture all the simultaneous effects of a single design decision. These models can be constructed with industry generic process models or customized with actual manufacturing process steps from your company.

External Analysis

In addition to being a suite of concurrent analysis tools, SavanSys is also a framework for running additional system analyses. SavanSys prepares the data, starts and manages the external analysis tool, and then displays the results within the tool. Example integrations include reliability prediction and full, finite, element-based thermal-analysis tools.

SavanSys Outputs

The SavanSys output is a virtual prototype of the design and target manufacturing flow, and provides you with complete and comprehensive manufacturing results including the size, cost, and yield of your product. SavanSys analyses produce results in the form of specifications for an optimal product. These specifications, including technology selection, product size, product partitioning, and product cost are then used as inputs for the remained of the design and manufacturing flow. These inputs guide and constrain the design activities to avoid size and cost obstacles that could occur late in the product design flow, when making design changes is expensive and time consuming.

Figure 3: SavanSys Sample Output

The SavanSys Core Technology combined with our experience is the foundation of our company. Below is a detailed description of the technology, but see our Products or Services section to understand how we apply this to help you.

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SavanSys Core Technology

SavanSys is designed for use early in the product lifecycle, so unlike most CAD tools it can be operated with either preliminary design data or with much more accurate design data. By performing accurate design and technology trade studies, the right design decisions can be made the first time, avoiding costly delays and design iterations.

·       The product design database can be as minimal as a bill of materials in an Excel spreadsheet, or as robust as a fully placed and routed board.

·       The component data, which is typically pulled from corporate libraries, includes technology information such as packaging options, design rules, and cost.

·       The manufacturing model is a flexible, activity-based model for chip preperation or board fabrication and assembly. The model can be selected from one of our industry standard flows, or constructed to precisely match the capabilities, costs, and yield of a particular manufacturing line.

Figure 2. SavanSys Concurrent Analysis

SavanSys Inputs