What’s the cost impact of... |
|
The SavanSys Wire Bond Trade Off Cost Model is designed with a simple philosophy: maximize the number of possible inputs while minimizing the number of required inputs. For parameters not known or specified, SavanSys will not only estimate it based on your other entries and the latest industry knowledge, but will show you the value used. This allows an unparalleled level of estimating customization without any training. Use the estimator to: · Define characteristics of the assembly site, fabrication site, and the design. See below for a complete list of parameters. · Compare against your previous results to easily understand how your modification affect the cost · View the detailed costs—including labor, material, capital, tooling, and yield impacts—of every step in the assembly process An optional enhancement to the estimator is to create a model calibrated to a specific supplier (internal or external). We can work with you to calibrate the model or work directly with the supplier to create a certified supplier model. |
|
Quickly see the cost impact as you make different design decisions |
Model Highlights |
|
· Estimate costs based on limited design info · Ensure consistent estimates based on the most current industry knowledge between all groups in your organization · Quantify the financial impact of design decisions · Understand your external or internal suppliers by correlating design decisions with quotes |
|
SavanSys Solutions LLC |
|
The Leader in Electronics Manufacturing Supply Chain Cost Modeling |
|
Home |
|
News |
|
Products |
|
Services |
|
Core Technology |
|
Technical Papers |
|
Contact Us |
|
· Cu vs. Au wire? · Changing substrate structure—2L? 4L? Laser drilling? · Different manufacturing locations? · Using a larger die? · Designing a smaller package? |
Parameter List |
|
Design |
Assembly |
Fabrication |
|
Pkg Size |
Labor Rate |
Labor Rate |
|
Pkg I/O |
Lot Size |
Utilization |
|
Structure |
Annual Vol |
Panel Size |
|
Design Rules |
Lifetime Vol |
Lot Size |
|
Wirebond Count |
Wafer Probe Yield |
|
|
Wire Length |
Utilization |
|
|
Wire Material |
Cost of Gold |
|
|
BGA Pitch |
|
|
|
umVia Count |
|
|
|
Heat Spreader |
|
|
|
Mold Comp. |
|
|
|
Surface Finish |
|
|
|
Die Size |
|
|
|
Die Cost |
|
|
|
Die Pad Pitch |
|
|
|
And more... |
||