Consulting Projects
 
What's Involved?

In a project, we are typically analyzing your technology or process in detail, or we are comparing two (or more) technologies.

In the first case, we'll build a process flow of your technology, then work with you to select multiple designs to run through the process. Next, we carry out robust sensitivity analysis. We identify all the major cost drivers of your process, then test the minimum and maximum range on each to understand the range of costs that might be associated with your design. The end result is a report that details the cost for all of your designs, an analysis of how those costs change with different assumptions, and a step-by-step cost output of the entire process flow.

The second type of project--and the more common one--is a comparison. This involves comparing two or more technologies. It can be as high-level as comparing the cost of a package built with two entirely separately technologies (flip chip versus fan-out), or it can be targeted down to a series of steps. For example, for equipment and material suppliers, SavanSys supplies the existing process flow for the current industry baseline process, and then only a few steps are changed to reflect the supplier's own internal process.

Once the process flows to be compared are complete, one or more designs are selected and run through both models. Next, we carry out robust sensitivity analysis. We identify the major cost drivers of both processes, and figure out which costs might make your technology more (or less) cost-effective against the competition. The goal is to understand the "sweet spot" for where your technology will compete.

The end result is a report that details the cost for your designs in both/all technologies analyzed, an analysis of how those costs change with different assumptions, a SavanSys consultant's assessment of how your technology may compete in the market, and a detailed, step-by-step output of the entire process flow.

Most projects involve an optional Phase II, which is the conversation of your project into software that you can run. It is not as robust (or expensive) as a full cost model, but allows you to carry out targeted trade-offs.

Example Projects

Every project is different and tailored to what you need. In general, however, they all share the same elements: a clear statement of the problem/comparison, a list of the key assumptions, a robust analysis of detailed results, and sensitivity analysis for all key cost drivers.

The goal of a project is to understand the full cost of the comparison, equipment, material, or process flow you are interested in. This means understanding the cost in all scenarios, not just for one or two individual designs.

There are two examples below of projects we have carried out in the past. All proprietary information has been scrubbed, and actual results have been adjusted.

Imaging Technology CoO Comparison

Technology Comparison Project: Fan-out, Flip Chip, and PoP

Examples of projects we have done
  • LDI versus traditional imaging CoO

  • Hybrid versus TC bonding

  • 20+ supplier specific models for one customer's supply chain

  • Supplier quote management and analysis

  • Single-wafer cleaning versus bath and spray photoresist stripping

  • Dry etch versus wet etch TSV reveal

  • FC versus Flip chip versus Fan-in versus fan-out

  • WB/FC SiP versus fan-out SiP

  • Panel Level packaging versus Wafer level packaging

  • HMC versus HBM

  • SWIFT-style and InFO-style fan-out PoP comparison

  • TMV versus Fan-out PoP

  • eWLB-style fan-out versus flip chip

  • Permanent wafer carrier versus temporary wafer carrier

  • Die stencil versus standard fan-out mold-first process

  • Rigid versus flex boards

  • Glass versus silicon interposer

  • Ink jet patterning versus traditional RDL creation methods

  • Stereolithography versus traditional RDL creation methods

  • Flip chip versus die-to-wafer stacking

  • Laser ablation RDL versus traditional RDL

  • mSAP versus embedded trace versus standard flip chip substrate processes

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